- Ź»óÇü ¸®ÇÃ·Î¿ì ¼Ö´õ¸µ ¿Àºì ¸®½ºÆ® - RnD, PP

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Ư.ÀåÁ¡ (USB Çö¹Ì°æÀ» ÇÔ²² »ç¿ëÇÏ¿© ³³¶« ½Ã¹Ä·¹ÀÌÅÍ·Î È°¿ë !)

È÷Æà ¹æ½Ä

Áú¼ÒºÐÀ§±â

ÃÖ°í ¼¼Æÿµµ

´Éµ¿Àû ³Ã°¢

ÃÖ´ë »ùÇà »çÀÌÁî(mm)

°üÂû â

µðÁöÅÐ Çö¹Ì°æ(¿É¼Ç)

X-Reflow

¿­Ç³ ´ë·ù

Yes

½Ç¿Â~350¡É

Yes (°ø³Ã-¿É¼Ç)

300 x 300

Yes-»óºÎ

Yes- (µ¿.Á¤Áö¿µ»ó)

XSO

¿­Ç³ ´ë·ù

Yes

½Ç¿Â~380¡É

Yes (°ø³Ã-¿É¼Ç)

457 x 356

Yes-4°³ °üÂûâ

Yes- (µ¿.Á¤Áö¿µ»ó)

X-106 MiniOven

¿­Ç³ ´ë·ù

Yes

50~350¡É

x

150 x 100

Yes-»óºÎ

Yes- (µ¿.Á¤Áö¿µ»ó)

 

 

 

 ¸ðµ¨: X-Reflow - ÃÖ½Å/ÃÖ°í »ç¾çÀÇ 100% ´ë·ù ¿­Ç³¹æ½Ä Ź»óÇü batch type ¸®ÇÃ·Î¿ì ¿Àºì

 

´Ù¾çÇÑ Æí¸®ÇÏ°í À¯¿ëÇÑ ±â´ÉÀ» °¡Áø µ¿±Þ ÃÖ°í »ç¾çÀÇ ¿¬±¸¿ë ¸®ÇÃ·Î¿ì ¿Àºì !

 

(±¹³».¿Ü ´ë±â¾÷, Áß¼Ò.º¥Ã³±â¾÷¿¡ ÆǸŠ: KIMM-Çѱ¹±â°è¿¬±¸¿ø, KATECH-Çѱ¹ÀÚµ¿Â÷¿¬±¸¿ø,
»ï¼ºÁ¤¹ÐÈ­ÇÐ, ´ö»êÇÏÀ̸ÞÅ», »ï¼ºÀüÀÚ, LGÀüÀÚ, ÄÁƼ³ÙÅ», ÇÁ·ÎÅØ, KDMTEC, KETI, LTML, ÀÎÅÚ,....)

 

 

µðÁöÅÐ Çö¹Ì°æ ÀåÂø »çÁø

ÀÚµ¿ÃÊÁ¡ µðÁöÅÐ Çö¹Ì°æ (¿É¼Ç)

Residual O2 monitor(¿É¼Ç)

Active cooler »çÁø(¿É¼Ç)

PC¿Í ¿¬°á »ç¿ë(¿É¼Ç)

 

(µ¿¿µ»ó/Á¤Áö¿µ»ó)

(è¹ö ³» N2 ·¹º§ ÃøÁ¤)

(´Éµ¿Àû ³Ã°¢ ½Ã½ºÅÛ)

(PC·Î ÄÁÆ®·Ñ/ÆíÁý/ÀúÀå...)

 

 

     

 

¿¬±¸¿ë "Scientific version" : ¿¬±¸¿ë µ¥ÀÌÅÍ°¡ ÇÊ¿äÇϽŠºÐµéÀÌ ¼±ÅÃÇϽô ¸ðµ¨ÀÔ´Ï´Ù !

  (Ư.ÀåÁ¡)  ÃֽŠŹ»óÇü batch ŸÀÔ, ¾÷°è ÃÖ°í ¼öÁØÀÇ »ç¾ç, ±â´É, ¿É¼Ç»çÇ× - µ¿¿µ»ó.Á¤Áö ÃÔ¿µ °¡´É, PC ¿¬µ¿, N2 ³óµµÃøÁ¤, ´Éµ¿Çü Äð¸µ...

  • ½Ì±Û è¹ö ¹æ½ÄÀÇ Å¹»óÇü 100% ´ë·ù ¿­Ç³¹æ½Ä ¹«¿¬(Pb-free) ¸®ÇÃ·Î¿ì ¼Ö´õ¸µ ¿Àºì
  • ÃÖ´ë PCB »çÀÌÁî: 305 mm x 305 mm
  • ¸¶ÀÌÅ©·Î ÇÁ·Î¼¼¼­ ÄÁÆ®·Ñ(closed-loop): zone ¼ö ¼³Á¤, ÃÖ´ë 9Á¸(purging:±âº»)- preheat- soak- reflow-2xcooling)±îÁö ¼¼Æà °¡´É
  • ¿Âµµ ¼¼Æà ¹üÀ§: 30~350°C( Àü.ÈÄ 2°³ÀÇ µ¶¸³µÈ È÷ÅÍ, PID ÄÁÆ®·Ñ äÅÃ), ±âŸ ´Ù¾çÇÑ ±â´Éµé(base, offset, overshoot.....)
  • ¿ÀÅä ÇÁ·ÎÆÄÀÏ ±â´É(Auto Profiling ±â´É): TC-T¸¦ »ç¿ëÇÏ¿© ¼³Á¤ °ªÀ» µû¶ó °øÁ¤ÀÌ ÀÚµ¿À¸·Î ÁøÇàµÇ¾î Æí¸®ÇÔ :
        Ãʺ¸ÀÚµµ ½±°Ô, Àü¹®°¡´Â ºü¸£°Ô °øÁ¤À» ¼¼ÆÃÇÏ°í ½ÇÇàÇÏ½Ç ¼ö ÀÖ½À´Ï´Ù . 2°³ÀÇ ³»ÀåÇü ½á¸ðÄ¿ÇÃ(TC-T & TC-B) ±âº» Á¦°ø.
  • ¼Ö´õÆäÀ̽ºÆ® ³³¶« ±â´É, ÇÖ º£ÀÌÅ· ±â´É, Àüµµ¼º Á¢ÂøÁ¦ °æÈ­ ±â´É, ±âŸ µîµî.
  • ³ÐÀº LCD display(µ¥ÀÌŸ, ±×·¡ÇÁ ¼±Åà °¡´É), LED ÁøÇàÁßÀÎ °øÁ¤ È®ÀÎ ·¥ÇÁ.
  • Áö´ÉÇü À¯ÇØ°¡½º ¹èÃâ ±â´É(HEPA filter, FumeXtract : ¿É¼Ç)
  • PC ¿¬°á »ç¿ë(Oven Monitor) : ½ÇÇèÇÑ ¸®ÇÃ·Î¿ì ¼Ö´õ¸µ ÇÁ·ÎÆÄÀÏ ÀÚ·áÀÇ ½Ç½Ã°£ ±â·Ï, ÀúÀå.ÆíÁý.ÇÁ¸°ÆÃ..... µîµî (¿É¼Ç)
  • ´Éµ¿Çü ³Ã°¢ ±â´É(2~4 °C/sec. : ¾ÐÃà °ø±â, Áú¼Ò °¡½º ÀÌ¿ë (¿É¼Ç)
  • N2 gas ³óµµ ÃøÁ¤: O2 monitor (¿É¼Ç)
  • 255°³ ¿Âµµ ÇÁ·ÎÆÄÀÏ ÀúÀå, ¼Õ ½¬¿î ¿î¿µ ¹æ¹ýÀÇ ÇÁ·Î±×·¥
  • ³ÐÀº »óºÎ °üÂûâ(200 x 200 mm) : À°¾È ¶Ç´Â USB Video long distance Çö¹Ì°æ (Á¤Áö¿µ»ó/µ¿¿µ»ó: ¿É¼Ç).....À¸·Î °üÂû.±â·Ï.ÀúÀå
  • N2 °¡½º ¿¬°á Æ÷Æ® - ³»ÀåÇü (¿ì¼öÇÑ ½Ç¸µ: 200ppm, or better)
  • Àΰ¡µÈ »ç¿ëÀÚ¸¸ »ç¿ëÅä·Ï 4´Ü°è·Î ¼¼ºÐÈ­µÈ »ç¿ëÀÚ ºÐ¸®/¾Ïȣȭ ±â´É(Guest, User, Admin, Factory)
  •  
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    ( PC ¿¬°á È­¸é : PC¿¡¼­ ÇÁ·ÎÆÄÀÏ ÄÁÆ®·Ñ/ÆíÁý/ÀúÀå.... ÀÛ¾÷ °¡´É
    )
     
  •  

     

    ±â¼ú »ç¾ç - Specifications -

     ÃÖ°í ¼³Á¤ ¿Âµµ

      50-350°C
     ÃÖ´ë PCB Å©±â   305 x 305 X 45(H) mm
     È÷Æà ÇÁ·Î¼¼½º   10Á¸ : N2 gas ÁÖÀÔ(purging), preheat - soak - reflow - cooling 1-2
     Á¦¾î   Á¤¹Ð P.I.D. control / LCD µð½ºÇ÷¹ÀÌ / ÁøÇà °øÁ¤ È®ÀÎ LED ·¥ÇÁ
     N2 °¡½º   N2 °¡½º »ç¿ë °¡´É
     È÷ÅÍ   Àü.ÈÄ 2°³
     »óºÎ °üÂûâ   200 x 200 mm (µðÁöÅÐ ÁÜ Çö¹Ì°æ ÀåÂø½Ã Á¤Áö¿µ»ó/µ¿¿µ»ó ÃÔ¿µ °¡´É)
     LCD display   ½ÇÁ¦ ¿Âµµ µ¥ÀÌŸ, ¶Ç´Â ¿Âµµ ±×·¡ÇÁ Ç¥½Ã
     ³»ÀåÇü TC   2°³ÀÇ ³»ÀåÇü K-type ½á¸ðÄ¿Çà (TC-T & TC-B)
     ´Éµ¿Çü ¹è±â ½Ã½ºÅÛ   FumeXtract with HEPA filter

     ÃÖ´ë ¼ÒºñÀü·Â

      6 kW (30A, 230V, 50/60Hz)

     ÇÁ·ÎÆÄÀÏ ¼ö   255 profiles
     to PC(±â·Ï.ÆíÁý.ÀúÀå.Ãâ·Â)   RS485 port(USB converter) + Oven Monitor Software
     Àåºñ Å©±â, ¹«°Ô   530 x 711 x 390 (D x L x H) mm,  57 Kg

     

     

     

     

    ´ëÇü ¸ðµ¨: XSO - ÃÖ½Å/ÃÖ°í »ç¾çÀÇ 100% ´ë·ù ¿­Ç³¹æ½Ä Ź»óÇü batch type ¸®ÇÃ·Î¿ì ¿Àºì

     

    ¼¼°èÀûÀÎ ±â¾÷, ¹Ì±¹ ÀÎÅڻ翡¼­ ¼±Á¤ÇÑ ÃÖ½Å.ÃÖ°í »ç¾çÀÇ ¿¬±¸¿ë ¸®ÇÃ·Î¿ì ¿Àºì !

     

     

     

    PC ¿¬°á È­¸é : PC¿¡¼­ ÇÁ·ÎÆÄÀÏ
    ÄÁÆ®·Ñ/ÆíÁý/ÀúÀå.... ÀÛ¾÷ °¡´É.

     

     

     

     

     

    Reflow area

    508 x 407 x 165H (mm)

    Temperature range

    30°C to 380°C

    Temperature Zones

    Purging, to push oxygen out + up to nine zones pre-set by the operator for each program. Last 2 zones are two cooling zones.

    Heaters

    4 heater cartridges  4,85 kW (220V)

    Max. PCB size

    18 ¡±x 14¡± (457 x 356 mm) 

    Supply Requirements

    3 phase, 220V, 40 amps (Max. power consumption: 20.5 kW)

    Advanced Cooling Module

    (Detachable to ease maintenance).

    Cooling media: Nitrogen or Shop Air. Timing and object temperature to cool to, is defined by the operator in the program.   Advanced cooling produces more reliable soldering connections and helps to handle heated objects at the end of a heating cycle. Opening and closure of the exhaust port is controlled by the programming.

    Monitoring Glass Windows

    There are 6 (six) viewing windows (°üÂûâ) :
     1) Àåºñ »óºÎ Áß¾Ó Ã¢ 1°³ - 283x283 mm
     2) Àåºñ ÇϺΠÁß¾Ó Ã¢ 1°³ - 190x190 mm
     3) Àåºñ Àü¸é â 1°³ - 280x100 mm
     4) Àåºñ Èĸé â 1°³ - 280x 100 mm

    Nitrogen Connection

    I/M 1/4 in. pneumatic male plug connector. Nitrogen pressure:
    1/2-1bar (7-14.5 psi) 

    Size

    856(L) x 850(W) x 550(H) (mm)

    Weight

           Unpacked: 220 lbs. (~100 kg) Packaged for shipping: 330Ibs. (~150kg)

    Computer profile control

    Allows pre-programming, storage and recall of up to 255 programs

    Communication with PC

    RS485 port ( XKAR X485-USB converter required to connect to PC¡¯s USB port)

          XSO Ư.ÀåÁ¡µé

    Heating and cooling rates between 2.0 C/sec to 3C/sec.

    Equipped Residual O2 Monitor when operating the oven in N2 environment.

    Display of the actual temperature/time numerically or as a graph and full indication of set functions and process parameters along with their values in the Process Window.

    Choice to control the temperature in the oven getting feedback from the measurement of the air temperature (conventional way) or to control the air temperature to heat the object to a preset temperature by measuring this object¡¯s real temperature using the ¡°K-type¡± thermocouple connected to this object.

    Advanced, two stage cooling system allowing use of N2 and the air to cool the heated object at the rate of few degrees per second.

    RS-485 port for controlling the oven and for downloading firmware upgrades from a PC.

    ³»ÀåÇü ¿Âµµ ÇÁ·ÎÆÄÀÏ·¯ – AUTO profiling ±â´É(TC-T control).

    Ready to solder in Nitrogen environment.

    Heating control by the temperature of the ¡°K¡± thermocouple attached to the heated object and to TC-T (a connector on the right side of the oven).

     

     

     

     

    ¼ÒÇü ¸ðµ¨: -106 MiniOven - ÃֽŠ»ç¾çÀÇ 100% ´ë·ù ¿­Ç³¹æ½Ä Ź»óÇü ¹Ì´Ï ¸®ÇÃ·Î¿ì ¿Àºì

     

    ¹«¿¬ ³³¶«, ¼ÒÇü PCB, reballing ¿ëµµ  !

     

     

    ¿É¼Ç : PC¿¡¼­ ÇÁ·ÎÆÄÀÏ
    ÄÁÆ®·Ñ/ÆíÁý/ÀúÀå.... ÀÛ¾÷ °¡´É.

     

    * ÀÛÁö¸¸ ¸Å¿ì °­·ÂÇÑ ´Ù¿ëµµÀÇ ¹Ì´Ï ¸®ÇÃ·Î¿ì ¿Àºì.

    * 100°³±îÁö ¿Âµµ ÇÁ·ÎÆÄÀÏ ÀúÀå °¡´É.

    * ¿Âµµ¹üÀ§ : 50°C ~ 350°C.

    * ¿Âµµ Á¸ - 5°³ : Preheat1, Preheat2, Soak, Reflow, Cooling.

    * È÷ÅÍ : 2 Heaters (Front and Rear) 800W each.

    * ÃÖ´ë PCB »çÀÌÁî :150 x 100 mm.

    * Àü¿ø : 16 amps, 115V or 8 amps 230V 50/60 Hz (Max power consumption: 1.8 kW);

    * »óºÎ °üÂû â Å©±â : 80 × 60 mm.

    * Áú¼Ò°¡½º  Æ÷Æ® : Standard 6mm line push-in connector,  ¾Ð·Â :1/2-1bar (7-14.5 psi);

    * SÀåºñ »çÀÌÁî : L=435mm x W=220mm x H=200mm

    * Áß·® : 8 kg

    * ¿É¼Ç : µðÁöÅÐ Çö¹Ì°æ : »óºÎ °üÂûâÀ» ÅëÇØ ³³¶«°øÁ¤ÀÇ µ¿¿µ»ó/Á¤Áö¿µ»ó µîÀ» ÃÔ¿µ/ÆíÁý/ÀúÀå °¡´É