- Ź ÷ο ִ Ʈ - RnD, PP

Ư. (USB ̰ Բ Ͽ ùķͷ Ȱ !)

Һ

ְ µ

Active cooling

ִ (mm)

â

̰(ɼ)

XReflow

dz

Y

300

Y

300 x 300

Y-

Y- (.)

XSO

dz

Y

400

Y

457 x 356

Y-6 â

Y- (.)

RSS ø

÷Ʈ

Y +

400

Y

160x160, 200x200, 300x300

Y-

Y- (.)

TWS 850N

dz

Y

250

N

240 x 330

Y-

N

 

 

 

 : XReflow-S - ֽ/ְ 100% dz Ź batch type ÷ο

 

 

 

 

 

 

 

 

 

 

Reflow area

20 x 16 x 6.5  (508 x 407 x 165H mm)

Temperature range

30°C to 400°C

Temperature Zones

Purging, to push oxygen out + up to nine zones pre-set by the operator for each program. Last 2 zones are two cooling zones.

Heaters

4 heater cartridges  4,88 kW (220V)

Max. PCB size

18 x 14 (457 x 356 mm) 

Supply Requirements

3 phase, 220V, 40 amps (Max. power consumption: 20.5 kW)

Advanced Cooling Module

(Detachable to ease maintenance).

Cooling media: Nitrogen or Shop Air. Timing and object temperature to cool to, is defined by the operator in the program.   Advanced cooling produces more reliable soldering connections and helps to handle heated objects at the end of a heating cycle. Opening and closure of the exhaust port is controlled by the programming.

Monitoring Glass Windows

There are 6 (six) viewing windows :
 1) ߾ â 1:  283×283 (mm)
 2) Ϻ ߾ â 1: 190x190 (mm)
 3) . â 2: 280x100 (mm)
 4) . â 2: 260x90 (mm)

Nitrogen Connection

I/M 1/4 in. pneumatic male plug connector. Nitrogen pressure:1/2-1bar (7-14.5 psi) 

Size

L=33.7 x W=33.5 x H=21,7 {L=856mm x W=850mm x H=-550mm

Weight

       Unpacked: 220 lbs. (~100 kg) Packaged for shipping: 330Ibs. (~150kg)

Computer profile control

Allows pre-programming, storage and recall of up to 255 programs

Communication with PC

RS485 port ( XKAR X485-USB converter required to connect to PCs USB port)

      XSO Ư.

Heating and cooling rates between 2.0 C/sec to 3C/sec.

Equipped Residual O2 Monitor when operating the oven in N2 environment.

Display of the actual temperature/time numerically or as a graph and full indication of set functions and process parameters along with their values in the Process Window.

Choice to control the temperature in the oven getting feedback from the measurement of the air temperature (conventional way) or to control the air temperature to heat the object to a preset temperature by measuring this objects real temperature using the K-type thermocouple connected to this object.

Advanced, two stage cooling system allowing use of N2 and the air to cool the heated object at the rate of few degrees per second.

RS-485 port for controlling the oven and for downloading firmware upgrades from a PC.

µ Ϸ – a data logger collecting info from eight external thermocouples.

Ready to solder in Nitrogen environment.

Heating control by the temperature of the K thermocouple attached to the heated object and to TC-T (a connector on the right side of the oven).

 

 

 : XReflow-S - ֽ/ְ 100% dz Ź batch type ÷ο

(. , ߼.ó Ǹ : Z, LG, ƼŻ(õ), , ,....)

 

̰

ĸ

Active cooler

FumeXtract

         

"Scientific version"

  (Ư.)  ֽ : Ź batch Ÿ  ְ   , ɼ  - . Կ

  • ̱ è Ź 100%  dz (Pb-free) ÷ο ִ
  • ִ PCB : 305 mm x 305 mm
  • ũ μ Ʈ(closed-loop): ִ 9(purging(⺻)- preheat-soak-reflow-cooling)
  • µ  : 30~350°C( . 2  , PID Ʈ ä)
  • (Auto Profiling ): TC-T Ͽ ڵ Ǿ :
        2 Ŀ(K-type thermocouple: TC-T & TC-B) ⺻
  • ִ̽Ʈ , ŷ , ȭ , Ÿ .
  • LCD display(Ÿ, ׷ ), LED Ȯ .
  • ذ (HEPA filter, FumeXtract)
  • PC (Oven Monitor) : ÷ο ִ ڷ ǽð , .
  • ɵ ð (2~4 °C/sec. : , ̿)
  • 255 µ ,  α׷
  • â(200 x 200 mm) : Ǵ USB Video ̰(ɼ) ..
  • N2  Ʈ - ( Ǹ: 200ppm, or better)
  • ΰ ڸ 4ܰ ȭ и/ȣȭ (Guest, User, Admin, Factory)
  • Ʈ (530  x 711 x 390(H) mm, 57 Kg)
  • 21A, 230V, 50/60Hz, 5 kW
  • made in EU (or USA)
  •  

    - Specifications -

     ְ µ

      30-350°C
     ִ PCB ũ   305 x 305 X 45 mm
      μ   10: N2 gas , preheat 1&2 - soak - reflow - cooling 1&2
         P.I.D. control / LCD ÷ / Ȯ LED
     N2   N2
      â   200 x 200 mm
     LCD display    µ Ÿ, Ǵ µ ׷ ǥ
      TC   2 K-type Ŀ (TC-T & TC-B)
     ɵ ý   FumeXtract with HEPA filter

     ִ Һ

      5 kW (21A, 230V, 50/60Hz)

        255 profiles
     to PC(...)   RS485 port(USB converter) + Oven Monitor Software
      ũ,   530 x 711 x 390 (D x L x H) mm,  57 Kg

     

     

     

    : RSS  ø - Ź batch type  ÷ο 

    (. , ߼.ó Ǹ : ںǰ(KETI), ڵ(ǿտ), LG ÷, ټ...)

    ΰ õ о(ڵ.Ƿ. .װ.) Ư Ͻʴϴ !

    Voidless & Fluxless !     ڼ Ʒ ׸ Ŭϼ !

     

     

     

    TWS 850 : dz Ź batch type - ÷ο

     

     

    Closed

    open

     

     

      (Ư.)    ݴ -Baking & Test

  • ̱ è Ÿ dz ÷ο
  • ִ PCB : 330 mm x 240 mm
  • ְ µ: 250°C
  • ŷ , ÷ο ִ , glue ȭ ..
  • LCD ġ ũ Ʈ dz(ð, µ, etc.)
  • ɼ: N2
  • ո
  • made in EU
  • ( )

     ְ µ  250°C
       P.I.D control
     ִ PCB ũ  330 x 240 mm
     ִ Һ  5 kW
       1
       220 Volt
       3 bar
      ũ  695 x 540 x 410 (D x W x H) mm
       25 Kg